Normal view MARC view ISBD view

Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I Materials Physics-Material Mechanics

Wong, C.P.,

Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I Materials Physics-Material Mechanics - USA : Springer, c2007 - xxx, 725 p.: ill.;

ISBN: 9780387484369

Dewey Class. No.: 621.381 / SUH/MIC

Print
Add to your cart (remove)
Suggest for purchase
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)

Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I Materials Physics-Material Mechanics

Working Hours

Quick Links

Quick Contact

Useful Links