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Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volume II Materials Physics-Material Mechanics

Wong, C.P.,

Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volume II Materials Physics-Material Mechanics - USA : Springer, c2007 - xxx, 735 p.: ill.;

ISBN: 9780387484369

Dewey Class. No.: 621.381 / SUH/MIC

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Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volume II Materials Physics-Material Mechanics

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