Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis
Material type: TextDescription: ix, 202p.: illISBN: 0824708652DDC classification: 621.381046Item type | Current library | Collection | Call number | Status | Date due | Barcode |
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Reference Books | Don Bosco Institute of Technology Library Reference | Electronics | 621.381046 JAM/PRA (Browse shelf(Opens below)) | Not for loan | 7560 |
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621.381045 KAS/OPT Optoelectronics And Phonics : Principal and Practices | 621.381045 ROS/OPT Optoelectronics | 621.381046 HAR/ELE Electronic Packaging and Interconnection Handbook | 621.381046 JAM/PRA Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis | 621.381046 PEC/PLA Placement and Routing of Electronic Modules | 621.3810685 BEC/ELE Electronic Quality Management Handbook | 621.3813 COL/FOU Foundations For Microwave Engineering |
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