Hybrid Assemblies and Multichip Modules

By: Kear, Fred W Material type: Text

TextPublication details: New York : Marcel Dekker Inc, c1993. Description: x, 278 p.: [8-A]ISBN: 0824784669DDC classification: 621.3815

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Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode
Reference Books	Don Bosco Institute of Technology Library Reference	Electronics	621.3815 KEA/HYB (Browse shelf(Opens below))	Not for loan		5394

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