TY  - BOOK
AU  - Hannemann, Robert J.
AU  - Kraus, Allan D.
AU  - Pecht, Michael. 
TI  - Semicondutor Packaging : A Multidisciplinary Approach
SN  - 0471181234
U1  - 621.381046 
PY  - 1994///
CY  - New York
PB  - John Wiley & Sons, Inc.
ER  -