TY  - BOOK
AU  - Wong, C.P.,
TI  - Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I  : Materials Physics-Material Mechanics
SN  - 9780387484369
U1  - 621.381 
PY  - 2007///
CY  - USA
PB  - Springer
ER  -