TY  - BOOK
AU  - Katsuyuki Sakuma
TI  - 3D Integration in VLSI Circuits: Implementation Technologies and  Applications
SN  - 9781315200699
PY  - 2018///
CY  - New York
PB  - CSC Press
UR  - http://opac.dbit.in/cgi-bin/koha/opac-retrieve-file.pl?id=73c5c70a251e38357fd57b377961116e
ER  -