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		No cover image available Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I Materials Physics-Material Mechanics by Wong, C.P. Material type: Text Publication details: USA : Springer, c2007Availability: Items available for reference: Don Bosco Institute of Technology Library: Not for loan (1)Call number: 621.381 SUH/MIC. Add to cart (remove)
		No cover image available Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volume II Materials Physics-Material Mechanics by Wong, C.P. Material type: Text Publication details: USA : Springer, c2007Availability: Items available for reference: Don Bosco Institute of Technology Library: Not for loan (1)Call number: 621.381 SUH/MIC. Add to cart (remove)

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