Normal view MARC view ISBD view

Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I Materials Physics-Material Mechanics

By: Wong, C.P Material type: Text

TextPublication details: USA : Springer, c2007 Description: xxx, 725 p.: illISBN: 9780387484369DDC classification: 621.381

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode
Reference Books	Don Bosco Institute of Technology Library Reference	Electronics	621.381 SUH/MIC (Browse shelf(Opens below))	Not for loan		13257

Previous				No cover image available	No cover image available			Next
Previous	621.381 PAD/IND Industrial Instrumentation : Principal and Design	621.381 SHM/COM Computer Arithmetics for Nanoelectronics	621.381 SIN Sig Sigma for Electronics Design and Manufacturing	621.381 SUH/MIC Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volum I Materials Physics-Material Mechanics	621.381 SUH/MIC Micro and Optical Electronic Materials and Physics, Mechanics Design Relibility, Packaing Volume II Materials Physics-Material Mechanics	621.3810 WAN/GRE Green Electronics Manufacturing creating Environmental sensible products	621.381 YAN/DEC Decision Diagram Techniques for Micro-and Nanoelectronic Design Handbook	Next

There are no comments on this title.

to post a comment.